Ultra-flat silicon wafer, type <100>

Ultra-Flat silicon wafer for demanding substrate studies. Can also be used as substrate for AFM or SEM samples by dicing the wafer into smaller pieces using a scriber and the Wafer Cleaving / Glass Breaking Pliers. The ultra-flat silicon wafer is shipped in a wafer carrier.

Properties for 150mm ultra-flat wafer:

  • Orientation: <100>
  • Grade: Prime / CZ Virgin
  • Resistivity: 1-10 Ohm/cm
  • Type: P / Dopant: Boron
  • Wafer Thickness: 675 ±25um
  • TTV: <= 1.5µm
  • Warp: <=30um / Bow: <= 30µm
    Particles: <= 30@>=0.2µm
  • Front surface: Polished
  • Back Surface: Etched
  • Flat: 1 per SEMI Standard (flat length 57.5 ±2.5mm)
  • Roughness: Typical 2-3 
Code Title Pack Size Availability Price Updated: 12-07-2024
GASUF06 Ultra-flat silicon wafer, type <100> Each 3 weeks $224.00 AUD