Ultra-flat SiNx coated silicon wafers, 200nm

The Ultra-Flat SiNx Substrates consist of ultra-flat silicon wafers coated with 200nm of amorphous nonstoichiometric ultra low-stress silicon nitride, similar to silicon nitride grids. The ultra-flat SiNx substrates are available in 6" wafer and conveniently diced 5 x 5mm, 5 x 7mm and 10 x 10mm chips. The 6" wafer is shipped in a 6" wafer carrier; the diced pieces are shipped in a Gel-Pak Box.

The wafers are stealth diced, a special clean dicing process which produces debris-free substrates. All products are packed in class 10 clean room conditions.

Properties for thermal SiNx substrates:

  • Material: CZ Virgin Silicon
  • Wafer Grade: Prime
  • Diameter: 150mm
  • Orientation: <100>
  • Type/Dopant: P/Boron
  • Resistivity: 10-20 Ohm-cm
  • Thickness: 675 ±25µm
  • TTV: ≤2µm
  • Site Flatness: ≤1µm
  • Warp: ≤30µm
  • Bow: ≤20µm
  • Front Surface: Polished
  • Back Surface: Etched
  • Flat: 1 per SEMI Standard
  • 2000A ±100A SiNx
Code Title Type Pack Size Availability Price Updated: 15-07-2024
GTP21630-510 Ultra-flat SiNx coated silicon wafers, 200nm 10 x 10mm wafers, Gel-Pak box Pack/6 3 weeks $416.00 AUD
GTP21630-55 Ultra-flat SiNx coated silicon wafers, 200nm 5 x 5mm wafers, Gel-Pak box Pack/25 3 weeks $426.00 AUD
GTP21630-57 Ultra-flat SiNx coated silicon wafers, 200nm 5 x 7mm wafers, Gel-Pak box Pack/18 3 weeks $426.00 AUD
GTP21630-6 Ultra-flat SiNx coated silicon wafers, 200nm 6" wafer, wafer carrier Each 3 weeks $721.00 AUD