Ultra-flat silicon wafer, type <100>

Ultra-Flat silicon wafer for demanding substrate studies. Can also be used as substrate for AFM or SEM samples by dicing the wafer into smaller pieces using a scriber and the Wafer Cleaving / Glass Breaking Pliers. The ultra-flat silicon wafer is shipped in a wafer carrier.

Properties:

Orientation: <100>
Grade: Prime / CZ Virgin
Resistivity: 1-10 Ohm/cm
Type: P / Dopant: Boron
Wafer Thickness: 675 ±25µm
TTV: <= 1.5µm
Warp: <=30µm / Bow: <= 30µm
Particles: <= 30@>=0.2µm
Front surface: Polished
Back Surface: Etched
Flat: 1 per SEMI Standard (flat length 57.5 ±2.5mm)
Size: 150mm diameter wafer or 5x5mm, 5x7mm or 10x10mm diced chips
Roughness: Typical 2-3

Please choose carefully. Returns of this item are subject to approval.

Updated: 25-08-2025

Code	Size	Pack Size	Availability	Price
GASUF06	152.4mm diameter	Each	0 in stock (?)	$250.00 AUD
GASUF5X5	5 x 5mm	Box/25	0 in stock (?)	$306.00 AUD
GASUF5X7	5 x 7mm	Box/18	0 in stock (?)	$306.00 AUD
GASUF10X10	10 x 10mm	Box/6	0 in stock (?)	$306.00 AUD

* Ordering Schedule

This item is available for back-order where 0 stock is listed.
We order from this manufacturer weekly, with an estimated lead time of 3 weeks.

This is the estimated lead time, based on the average time taken previously to fill orders from this particular supplier.
Lead times are from when we receive your order until when we fill your order. For delivery times, please see shipping information below.