PELCO FlexScribe

The PELCO FlexScribe (formerly from LatticeGear) is a super-fast, simple method for downsizing wafers and samples by scribing on the topside. It uses a scribing wheel mounted to a sliding scribing mechanism that always makes a straight scribe. This system is used to scribe a wide variety of materials without restrictions on shape, including glass slides, coverslips, silicon, III-V, sapphire and other crystalline and brittle materials. It can address very small samples down to 5mm up to 200mm wafers for the TTP54340 model, and up to 300mm wafers for the TTP54342 model.

The standard tungsten carbide cutter installed on the PELCO FlexScribe is great for a wide variety of samples including silicon, glass, GaAs and other crystalline materials. Diamond and deep-cutting scribing wheels are also available.

Indenter recommendations:

TTP54346  Tungsten carbide scribing wheel is good for general purpose use.
TTP54343  Diamond cutter for very thin glass, tempered glass and hard materials such as sapphire.
TTP54344  Deep cutting wheel, for applications like thick glass or off-axis cleaving.

Applications:

• Break down wafers
• Cleave strips and dies
• Cleave off crystal axis
• Cleave glass and Sapphire
• Cut coupons for section cleaving
• Cleave irregular shapes

Available: