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Ultra-flat silicon wafer, type <100>
Ultra-Flat silicon wafer for demanding substrate studies. Can also be used as substrate for AFM or SEM samples by dicing the wafer into smaller pieces using a scriber and the Wafer Cleaving / Glass Breaking Pliers. The ultra-flat silicon wafer is shipped in a wafer carrier.
Properties:
- Orientation: <100>
- Grade: Prime / CZ Virgin
- Resistivity: 1-10 Ohm/cm
- Type: P / Dopant: Boron
- Wafer Thickness: 675 ±25um
- TTV: <= 1.5µm
- Warp: <=30um / Bow: <= 30µm
Particles: <= 30@>=0.2µm - Front surface: Polished
- Back Surface: Etched
- Flat: 1 per SEMI Standard (flat length 57.5 ±2.5mm)
- Size: 6" (150mm) diameter wafer or 5x5mm, 5x7mm or 10x10mm diced chips
- Roughness: Typical 2-3
Please choose carefully. Returns of this item are subject to approval.
Updated: 22-01-2025
| Code | Title | Size | Pack Size | Availability | Price | Updated: 22-01-2025 |
|---|---|---|---|---|---|---|
| GASUF06 | Ultra-flat silicon wafer, type <100> | 152.4mm diameter | Each | 3 weeks | $247.00 AUD | |
| GASUF5X5 | Ultra-flat silicon wafer, type <100> | 5 x 5mm | Box/25 | 3 weeks | $320.00 AUD | |
| GASUF5X7 | Ultra-flat silicon wafer, type <100> | 5 x 7mm | Box/18 | 3 weeks | $320.00 AUD | |
| GASUF10X10 | Ultra-flat silicon wafer, type <100> | 10 x 10mm | Box/6 | 3 weeks | $320.00 AUD |
* Availability Explanation
X weeks – the estimated lead time, based on the average time taken previously to fill orders from this particular supplier. Lead times are from when we receive your order until when we fill your order. For delivery times, please see shipping information below.
In Stock – Plenty of stock on the shelf, ready to ship.
No ETA – our supplier has advised they cannot provide an accurate ETA. Generally there is some issue with supply, and it may be more than 6 months.
