Ultra-flat SiNx coated silicon wafers, 200nm

The Ultra-Flat SiNx Substrates consist of ultra-flat silicon wafers coated with 200nm of amorphous nonstoichiometric ultra low-stress silicon nitride, similar to silicon nitride grids. The ultra-flat SiNx substrates are available in 6" wafer and conveniently diced 5 x 5mm, 5 x 7mm and 10 x 10mm chips. The 6" wafer is shipped in a 6" wafer carrier; the diced pieces are shipped in a Gel-Pak Box.

The wafers are stealth diced, a special clean dicing process which produces debris-free substrates. All products are packed in class 10 clean room conditions.

Properties for thermal SiNx substrates:

  • Material: CZ Virgin Silicon
  • Wafer Grade: Prime
  • Diameter: 150mm
  • Orientation: <100>
  • Type/Dopant: P/Boron
  • Resistivity: 10-20 Ohm-cm
  • Thickness: 675 ±25µm
  • TTV: ≤2µm
  • Site Flatness: ≤1µm
  • Warp: ≤30µm
  • Bow: ≤20µm
  • Front Surface: Polished
  • Back Surface: Etched
  • Flat: 1 per SEMI Standard
  • 2000A ±100A SiNx
Updated: 22-01-2025
Code Title Type Pack Size Availability Price Updated: 22-01-2025
GTP21630-510 Ultra-flat SiNx coated silicon wafers, 200nm 10 x 10mm wafers, Gel-Pak box Pack/6 3 weeks $386.00 AUD
GTP21630-55 Ultra-flat SiNx coated silicon wafers, 200nm 5 x 5mm wafers, Gel-Pak box Pack/25 3 weeks $395.00 AUD
GTP21630-57 Ultra-flat SiNx coated silicon wafers, 200nm 5 x 7mm wafers, Gel-Pak box Pack/18 3 weeks $395.00 AUD
GTP21630-6 Ultra-flat SiNx coated silicon wafers, 200nm 6" wafer, wafer carrier Each 3 weeks $721.00 AUD

* Availability Explanation

X weeks – the estimated lead time, based on the average time taken previously to fill orders from this particular supplier. Lead times are from when we receive your order until when we fill your order. For delivery times, please see shipping information below.

In Stock – Plenty of stock on the shelf, ready to ship.

No ETA – our supplier has advised they cannot provide an accurate ETA. Generally there is some issue with supply, and it may be more than 6 months.