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Ultra-flat SiNx coated silicon wafers, 200nm
The Ultra-Flat SiNx Substrates consist of ultra-flat silicon wafers coated with 200nm of amorphous nonstoichiometric ultra low-stress silicon nitride, similar to silicon nitride grids. The ultra-flat SiNx substrates are available in 6" wafer and conveniently diced 5 x 5mm, 5 x 7mm and 10 x 10mm chips. The 6" wafer is shipped in a 6" wafer carrier; the diced pieces are shipped in a Gel-Pak Box.
The wafers are stealth diced, a special clean dicing process which produces debris-free substrates. All products are packed in class 10 clean room conditions.
Properties for thermal SiNx substrates:
- Material: CZ Virgin Silicon
- Wafer Grade: Prime
- Diameter: 150mm
- Orientation: <100>
- Type/Dopant: P/Boron
- Resistivity: 10-20 Ohm-cm
- Thickness: 675 ±25µm
- TTV: ≤2µm
- Site Flatness: ≤1µm
- Warp: ≤30µm
- Bow: ≤20µm
- Front Surface: Polished
- Back Surface: Etched
- Flat: 1 per SEMI Standard
- 2000A ±100A SiNx
| Code | Type | Pack Size | Availability | Price | Updated: 17-06-2025 |
|---|---|---|---|---|---|
| GTP21630-510 | 10 x 10mm wafers, Gel-Pak box | Pack/6 | 0 in stock (?) | $443.00 AUD | |
| GTP21630-55 | 5 x 5mm wafers, Gel-Pak box | Pack/25 | 0 in stock (?) | $454.00 AUD | |
| GTP21630-57 | 5 x 7mm wafers, Gel-Pak box | Pack/18 | 0 in stock (?) | $454.00 AUD | |
| GTP21630-6 | 6" wafer, wafer carrier | Each | 0 in stock (?) | $778.00 AUD |
* Ordering Schedule
This item is available for back-order where 0 stock is listed.
We order from this manufacturer weekly, with an estimated lead time of 3 weeks.
This is the estimated lead time, based on the average time taken previously to fill orders from this particular supplier.
Lead times are from when we receive your order until when we fill your order. For delivery times, please see shipping information below.
