PELCO FIB lift-out TEM grids and half grids

The PELCO FIB Lift-Out TEM Grids fit in all standard TEM holders providing access, flexibility and full view of the lamella attached to posts. Designed for in-situ lift to attach the TEM lamellas milled out by SEM/FIB or FIB systems. 

Copper: 

Typical thickness is 35µm ±5µm, thinner ridge on the inside, where the lamellas can be attached and are protected when stored. Size of wide post - 250 x 35 (W x D), 190µm or 55µm thick. Size of narrow post - 80 x 35 (W x D), 190µm thick.

Molybdenum:

Typical thickness is 50µm ±5µm.  Size of wide post - 250 x 50 (W x D), 190µm thick.

Silicon:

Typical thickness is 100µm. Debris-free, metal-free lift-out grids which readily bond with Pt to attach the lamellas. B-doped, conductive silicon minimises charging during sample preparation and TEM imaging. Size of narrow post - 80 x 100 (W x D), 190µm thick (can be shaped if needed)

Copper Beryllium:

Stiff, with a thickness of 100µm, diameter 3mm with a height of 1.5mm. Slot is 2mm wide x 0.5mm deep. Easy handling and good protection for the TEM lamellas with two dots on one side for easy identification.