TiOx coated Substratek grids, 400 mesh copper

The Substratek TEM Substrates are metallic ultrathin films on a standard 3mm TEM grid. Available substrate are Au, Pt, Pd (2-3nm thickness) and TiOx (10-20nm thickness) on 300 and 400mesh TEM grids. The Au, Pt and Pd substrates are deposited on gold TEM grids compatible with electrochemical processes. The TiOx substrate is deposited on copper TEM grids; These materials have proven to be stable substrates with a small feature size in the support film. The TiOx substrate is more bio-compatible and can also be used for life-science applications. They are supplied in a PELCO 160 TEM grid box in quantities of 25 per box.

G400: Pitch 62µm; Hole Width 37µm; Bar Width 25µm; Transmission 37%

PEL21440-25: Substratek, 10-20nm TiOx on 400 mesh Cu TEM grid

 

Updated: 22-01-2025
Code Title Size Material Pack Size Availability Price Updated: 22-01-2025
PEL21440-25 TiOx coated Substratek grids, 400 mesh copper 10-20mm TiOx Copper Pack/25 3 weeks $187.00 AUD

* Availability Explanation

X weeks – the estimated lead time, based on the average time taken previously to fill orders from this particular supplier. Lead times are from when we receive your order until when we fill your order. For delivery times, please see shipping information below.

In Stock – Plenty of stock on the shelf, ready to ship.

No ETA – our supplier has advised they cannot provide an accurate ETA. Generally there is some issue with supply, and it may be more than 6 months.