SEM silicon wafer substrates, Type P, 111
SEM silicon wafer substrates, Type P, 111
SEM silicon wafer substrates, Type P, 111
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SEM silicon wafer substrates, Type P, 111

These silicon wafers can be used either as a substrate for thin film research or to make small silicon substrates by dicing the wafer into smaller pieces using a scriber and the Wafer Cleaving / Glass Breaking Pliers. The wafer is shipped in a wafer carrier.

Properties:

  • Orientation: <100> or <111> for 76.2mm wafer
  • Resistance: 1-30 Ohms
  • Type P: (Boron) (1 primary flat)
  • No SiO2 top coating
  • Wafer thickness:
    • 25.4mm diameter = 254 - 304µm
    • 50.8mm diameter = 230-330µm
    • 76.2mm diameter = 345-470µm
    • 101.6mm diameter = 475-575µm
    • 127mm diameter = 600-690µm
  • Roughness: 2nm
  • TTV: = <20µm
  • Wafer is polished on one side
Updated: 26-10-2025
Code Size Pack Size Availability Price Updated: 26-10-2025
GAS02 50.8mm Each 0 in stock (?) $78.00 AUD
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GAS03 76.2mm Each 0 in stock (?) $81.00 AUD
GAS04 101.6mm Each 0 in stock (?) $106.00 AUD
GAS06 127mm Each 0 in stock (?) $155.00 AUD
PEL16011 25.4mm Each 0 in stock (?) $120.00 AUD