SEM silicon wafer substrates, Type P, 111
These silicon wafers can be used either as a substrate for thin film research or to make small silicon substrates by dicing the wafer into smaller pieces using a scriber and the Wafer Cleaving / Glass Breaking Pliers. The wafer is shipped in a wafer carrier.
Properties:
- Orientation: <100> or <111> for 76.2mm wafer
- Resistance: 1-30 Ohms
- Type P: (Boron) (1 primary flat)
- No SiO2 top coating
- Wafer thickness:
- 25.4mm diameter = 254 - 304µm
- 50.8mm diameter = 230-330µm
- 76.2mm diameter = 345-470µm
- 101.6mm diameter = 475-575µm
- 127mm diameter = 600-690µm
- Roughness: 2nm
- TTV: = <20µm
- Wafer is polished on one side
* Ordering Schedule
This item is available for back-order where 0 stock is listed.
We order from this manufacturer weekly, with an estimated lead time of 3 weeks.
This is the estimated lead time, based on the average time taken previously to fill orders from this particular supplier.
Lead times are from when we receive your order until when we fill your order. For delivery times, please see shipping information below.