Ultra-flat silicon wafer, type <100>

Ultra-Flat silicon wafer for demanding substrate studies. Can also be used as substrate for AFM or SEM samples by dicing the wafer into smaller pieces using a scriber and the Wafer Cleaving / Glass Breaking Pliers. The ultra-flat silicon wafer is shipped in a wafer carrier.

Properties for 150mm ultra-flat wafer:

• Orientation: <100>
• Grade: Prime / CZ Virgin
• Resistivity: 1-10 Ohm/cm
• Type: P / Dopant: Boron
• Wafer Thickness: 675 +/- 25um
• TTV: <= 1.5um
• Warp: <=30um / Bow: <= 30um
  Particles: <= 30@>=0.2um
• Front surface: Polished
• Back Surface: Etched
• Flat: 1 per SEMI Standard (flat length 57.5 ?2.5mm)
• Roughness: Typical 2-3