- Collections
Ultra-flat SiNx coated silicon wafers, 200nm
The Ultra-Flat SiNx Substrates consist of ultra-flat silicon wafers coated with 200nm of amorphous nonstoichiometric ultra low-stress silicon nitride, similar to silicon nitride grids. The ultra-flat SiNx substrates are available in 6" wafer and conveniently diced 5 x 5mm, 5 x 7mm and 10 x 10mm chips. The 6" wafer is shipped in a 6" wafer carrier; the diced pieces are shipped in a Gel-Pak Box.
The wafers are stealth diced, a special clean dicing process which produces debris-free substrates. All products are packed in class 10 clean room conditions.
Properties for thermal SiNx substrates:
- Material: CZ Virgin Silicon
- Wafer Grade: Prime
- Diameter: 150mm
- Orientation: <100>
- Type/Dopant: P/Boron
- Resistivity: 10-20 Ohm-cm
- Thickness: 675 +/- 25µm
- TTV: ≤2µm
- Site Flatness: ≤1µm
- Warp: ≤30µm
- Bow: ≤20µm
- Front Surface: Polished
- Back Surface: Etched
- Flat: 1 per SEMI Standard
- 2000A +/- 100A SiNx
Please choose carefully. Returns of this item are subject to approval.
| Code | Title | Type | Pack Size | Availability | Price | Updated: 28-04-2024 |
|---|---|---|---|---|---|---|
| GTP21630-510 | Ultra-flat SiNx coated silicon wafers, 200nm | 10 x 10mm wafers, Gel-Pak box | Pack/6 | 3 weeks | $416.00 AUD | |
| GTP21630-55 | Ultra-flat SiNx coated silicon wafers, 200nm | 5 x 5mm wafers, Gel-Pak box | Pack/25 | 3 weeks | $426.00 AUD | |
| GTP21630-57 | Ultra-flat SiNx coated silicon wafers, 200nm | 5 x 7mm wafers, Gel-Pak box | Pack/18 | 3 weeks | $426.00 AUD | |
| GTP21630-6 | Ultra-flat SiNx coated silicon wafers, 200nm | 6" wafer, wafer carrier | Each | 3 weeks | $721.00 AUD | |
