Diamond sectioning and wafering blade, 15.9mm arbor

This sectioning blade can be used on PELCO XP-300, PELCO CS600A and PCS-400.These competitively priced Smart Cut precision diamond wafering blades are designed to provide superior smooth surface quality, low-distortion sectioning and enhanced blade life. The man-made diamond crystals in the Smart Cut diamond sectioning blades / wafering blades are oriented in such a way that diamonds are only activated at the exposed layer. As the exposed layer begins to wear out, diamonds in a new layer are activated, keeping up the cutting rate.The advantages are:Faster cutting action - leaves smooth finishLess glazing - requires minimal dressingMore universal - compatible with a greater variety of materialsAll Smart Cut diamond blades have a metal bonded diamond height of 4mm and are available in 3, 4, 5 & 6 in. diameter with the industry standard 1/2 in. or 5/8 in. holes. Three grades are offered to fit most applications:LC200MF medium/fine grit - lo...

This sectioning blade can be used on PELCO XP-300, PELCO CS600A and PCS-400.

These competitively priced Smart Cut precision diamond wafering blades are designed to provide superior smooth surface quality, low-distortion sectioning and enhanced blade life. The man-made diamond crystals in the Smart Cut diamond sectioning blades / wafering blades are oriented in such a way that diamonds are only activated at the exposed layer. As the exposed layer begins to wear out, diamonds in a new layer are activated, keeping up the cutting rate.

The advantages are:
Faster cutting action - leaves smooth finish
Less glazing - requires minimal dressing
More universal - compatible with a greater variety of materials
All Smart Cut diamond blades have a metal bonded diamond height of 4mm and are available in 3, 4, 5 & 6 in. diameter with the industry standard 1/2 in. or 5/8 in. holes. Three grades are offered to fit most applications:

LC200MF medium/fine grit - low concentration for hard and tough materials, hard coating, hard ceramics and concrete (equivalent to Buehler 15LC)
HC150MC medium/coarse grit - high concentration for composite materials, PCB, soft metals and bone (equivalent to Buehler 15HC)
HC320F fine grit - high concentration for glass fibre and carbon composites, soft ceramics and optical materials (equivalent to Buehler 5LC and 10LC)

Updated: 03-12-2024
Code Title Grit Pack Size Availability Price Updated: 03-12-2024
PEL812-315-5 Diamond sectioning and wafering blade, 15.9mm arbor Medium/fine Each 3 weeks $419.00 AUD
PEL812-316-5 Diamond sectioning and wafering blade, 15.9mm arbor Medium/coarse Each 3 weeks $393.00 AUD
PEL812-317-5 Diamond sectioning and wafering blade, 15.9mm arbor Fine Each 3 weeks $393.00 AUD

* Availability Explanation

X weeks – the estimated lead time, based on the average time taken previously to fill orders from this particular supplier. Lead times are from when we receive your order until when we fill your order. For delivery times, please see shipping information below.

In Stock – Plenty of stock on the shelf, ready to ship.

No ETA – our supplier has advised they cannot provide an accurate ETA. Generally there is some issue with supply, and it may be more than 6 months.