Diamond sectioning and wafering blade, 15.9mm arbor

This sectioning blade can be used on PELCO XP-300, PELCO CS600A and PCS-400.

These competitively priced Smart Cut precision diamond wafering blades are designed to provide superior smooth surface quality, low-distortion sectioning and enhanced blade life. The man-made diamond crystals in the Smart Cut diamond sectioning blades/wafering blades are oriented in such a way that diamonds are only activated at the exposed layer. As the exposed layer begins to wear out, diamonds in a new layer are activated, keeping up the cutting rate.

Features:

• Faster cutting action - leaves smooth finish
• Less glazing - requires minimal dressing
• More universal - compatible with a greater variety of materials
• All Smart Cut diamond blades have a metal bonded diamond height of 4mm and are available in 76.2mm to 152.4mm diameter with the industry standard 12/7mm or 15.9mm holes.

Three grades are offered to fit most applications:

LC200MF medium/fine grit - low concentration for hard and tough materials, hard coating, hard ceramics and concrete (equivalent to Buehler 15LC)
HC150MC medium/coarse grit - high concentration for composite materials, PCB, soft metals and bone (equivalent to Buehler 15HC)
HC320F fine grit - high concentration for glass fibre and carbon composites, soft ceramics and optical materials (equivalent to Buehler 5LC and 10LC)