PELCO FIB lift-out TEM grids and half grids

The PELCO FIB Lift-Out TEM Grids fit in all standard TEM holders providing access, flexibility and full view of the lamella attached to posts. Designed for in-situ lift to attach the TEM lamellas milled out by SEM/FIB or FIB systems. 

Copper: 

Typical thickness is 35µm ±5µm, thinner ridge on the inside, where the lamellas can be attached and are protected when stored. Size of wide post - 250 x 35 (W x D), 190µm or 55µm thick. Size of narrow post - 80 x 35 (W x D), 190µm thick.

Molybdenum:

Typical thickness is 50µm ±5µm.  Size of wide post - 250 x 50 (W x D), 190µm thick.

Silicon:

Typical thickness is 100µm. Debris-free, metal-free lift-out grids which readily bond with Pt to attach the lamellas. B-doped, conductive silicon minimises charging during sample preparation and TEM imaging. Size of narrow post - 80 x 100 (W x D), 190µm thick (can be shaped if needed)

Copper Beryllium:

Stiff, with a thickness of 100µm, diameter 3mm with a height of 1.5mm. Slot is 2mm wide x 0.5mm deep. Easy handling and good protection for the TEM lamellas with two dots on one side for easy identification.

Updated: 26-08-2025
Code Material Size Pack Size Availability Price Updated: 26-08-2025
GF301-CU1 Copper 1 wide post, 190μm thick Pack/100 0 in stock (?) $209.00 AUD
GF301-CU2 Copper 2 wide posts, 190μm thick Pack/100 0 in stock (?) $223.00 AUD
GF301-CU4 Copper 4 narrow posts, 190μm thick Pack/100 0 in stock (?) $233.00 AUD
GF301-MO2 Molybdenum 2 wide posts, 190μm thick Pack/25 0 in stock (?) $325.00 AUD
GF301-SI4 Silicon 4 narrow posts, 190μm thick Pack/10 0 in stock (?) $476.00 AUD
GF302 Copper/beryllium Half grid Pack/25 0 in stock (?) $73.00 AUD
GTP10GC02T Copper 1 wide post, 55μm thick Pack/100 0 in stock (?) $211.00 AUD
GTP4510-HALF Copper Beryllium Half Grid Pack/25 0 in stock (?) $72.00 AUD