PELCO Precision Wire Saw, 100-240V 50/60Hz

The PELCO Precision Wire Saw is capable of cutting a variety of materials while minimising damage from the cutting process using a gentle lapping action. This gentle action combined with high precision and low kerf damage makes the Diamond Wire Saw ideal for slicing samples where minimising mechanical damage and precise positioning of the cut are critical. This wire saw is an updated version of the South Bay Technology Model 850 Abrasive Slurry Saw / Wire Saw.

The saw is ideal for cutting materials such as sapphire, silicon, glass and germanium as well as tough materials such as tungsten, aluminium, brass and steel. It is highly useful for cutting fragile crystals, substrates with delicate layers, or any material that might otherwise be damaged using other cutting methods.

Features:

• Very gentle, low damage cutting for many types of materials and single crystals
• Easily replaceable wire blades with adjustable tensioning mechanism
• Recirculating slurry/coolant system included ETL and CE certified
• A wide variety of sample holders allow mounting of virtually any sample shape
• Multi-axis Precision Goniometer available for single crystal cutting and other demanding tasks
• Optional accessories available including Inspection Microscope, work tables, mounts and adapters

Cutting Blades:

Wire loop blades - Diamond-embedded stainless steel wire blades or plain stainless steel wire blades may be used (with abrasive slurry). Blade diameters of 0.010 and 0.015" are available. The wire blades can be easily changed and appropriately tensioned within a few moments.

Accessories:

A variety of sample holders and fixtures are available to cut virtually any sample geometry without difficulty. Oriented crystals, awkward geometries, or flat samples can all be cut using the various holders available. An inspection microscope attachment is also available, for extra precision and additional ease for alignment of difficult samples. It can also be used as a string saw to cut water-soluble crystals.

Operation:

Sample is mounted to mount and placed on the work table. The work table is mounted on a micrometer-controlled indexing cross-feed to allow precise, parallel slices to be taken. An appropriate load is applied by adjusting the weight on the wire arm. Cooling liquid/abrasive is applied using the supplied recirculating cooling/slurry supply system. Slurry flow is controlled by an included peristaltic pump unit.

Specifications:

• Overall Dimensions: 711mm L x 229mm W x 280mm H
• Electrical: 100-240 VAC 50/60 Hz Universal Power
• Maximum Sample Diameter: 63mm
• Wire Speed: 40-475 RPM
• Cross Feed Range: 50mm maximum
• Micrometer Feed: 0-25mm at 0.01mm increments